Cite this DOI

G Shobha, B Swetha, & V David (2021). The State-of-the-Art in IC Reverse Engineering. *Journal of Science & Technology*, *06*(05), 146–167. https://doi.org/10.46243/jst.2021.v6.i05.pp146-167

@article{gshobha2021stateoftheart,
  author    = {G Shobha and B Swetha and V David},
  title     = {{The State-of-the-Art in IC Reverse Engineering}},
  journal   = {Journal of Science \& Technology},
  year      = {2021},
  month     = {oct},
  volume    = {06},
  number    = {05},
  pages     = {146--167},
  publisher = {Longman Publishers},
  issn      = {2456-5660},
  doi       = {10.46243/jst.2021.v6.i05.pp146-167},
  url       = {https://doi.org/10.46243/jst.2021.v6.i05.pp146-167},
  language  = {en},
  abstract  = {This paper gives an overview of the place of reverse engi- neering (RE) in the semiconductor industry, and the techniques used to obtain information from semiconductor products. The continuous drive of Moores law to increase the integration levelof silicon chips has presented major challenges to the reverse engineer, obsolescing simple teardowns, and demanding the adoption of new and more sophisticated technology to analyse chips. Hardware encryption embedded in chips adds a whole other level of difficulty to IC analysis. This paper covers product teardowns, and discusses the techniques used for system-level analysis, both hardware and software; circuit extraction, taking the chip down to the transistor level, and working back up through the interconnects to create schematics; and process analysis, looking athow a chip is made, and what it is made of. Examples are also given of each type of RE. The paper concludes with a case study of the analysisof an IC with embedded encryption hardware.}
}

TY  - JOUR
TI  - The State-of-the-Art in IC Reverse Engineering
AU  - G Shobha
AU  - B Swetha
AU  - V David
JO  - Journal of Science & Technology
PY  - 2021
DA  - 2021/10/29/
VL  - 06
IS  - 05
SP  - 146
EP  - 167
PB  - Longman Publishers
SN  - 2456-5660
LA  - en
AB  - This paper gives an overview of the place of reverse engi- neering (RE) in the semiconductor industry, and the techniques used to obtain information from semiconductor products. The continuous drive of Moores law to increase the integration levelof silicon chips has presented major challenges to the reverse engineer, obsolescing simple teardowns, and demanding the adoption of new and more sophisticated technology to analyse chips. Hardware encryption embedded in chips adds a whole other level of difficulty to IC analysis. This paper covers product teardowns, and discusses the techniques used for system-level analysis, both hardware and software; circuit extraction, taking the chip down to the transistor level, and working back up through the interconnects to create schematics; and process analysis, looking athow a chip is made, and what it is made of. Examples are also given of each type of RE. The paper concludes with a case study of the analysisof an IC with embedded encryption hardware.
DO  - 10.46243/jst.2021.v6.i05.pp146-167
UR  - https://doi.org/10.46243/jst.2021.v6.i05.pp146-167
ER  -

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    "title": "The State-of-the-Art in IC Reverse Engineering",
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    "abstract": "This paper gives an overview of the place of reverse engi- neering (RE) in the semiconductor industry, and the techniques used to obtain information from semiconductor products. The continuous drive of Moores law to increase the integration levelof silicon chips has presented major challenges to the reverse engineer, obsolescing simple teardowns, and demanding the adoption of new and more sophisticated technology to analyse chips. Hardware encryption embedded in chips adds a whole other level of difficulty to IC analysis. This paper covers product teardowns, and discusses the techniques used for system-level analysis, both hardware and software; circuit extraction, taking the chip down to the transistor level, and working back up through the interconnects to create schematics; and process analysis, looking athow a chip is made, and what it is made of. Examples are also given of each type of RE. The paper concludes with a case study of the analysisof an IC with embedded encryption hardware.",
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From the record as registered (version 2) — the record and its history. Programs: https://registry.smartscholars.in/api.php?action=cite&doi=10.46243%2Fjst.2021.v6.i05.pp146-167 gives all four in one JSON answer.